Company joins international semiconductor substrate and packaging exhibition
Showcases 2.5D, 2.1D substrates used in AI accelerators
Also introduces core next-generation glass substrate technology
Samsung Electro-Mechanics will present next-generation semiconductor package substrates built to support AI accelerators, data centers and autonomous driving performance at KPCA Show 2026. The event, the International Semiconductor Substrate and Advanced Packaging Industry Exhibition, runs Wednesday through Friday at Songdo Convensia in Incheon.
At the exhibition, the company will display five product lines: 2.5D package substrates, 2.1D package substrates, glass substrates, automotive FC BGA substrates and ultra-thin chip scale package (UTCSP) substrates.
Semiconductor package substrates serve as an intermediary link between semiconductor chips and mainboards, enabling electrical signals to pass smoothly between them.
As the AI accelerator trend moves toward integrating multiple high-performance chips into a single package, substrates are evolving as well, growing larger in area and stacking into more layers.
Samsung Electro-Mechanics' 2.5D package substrates apply technology that reduces warping caused by larger surface areas and higher layer counts. The company has also introduced high-speed signal transmission and high-density connection technologies, aiming to supply the substrates to high-performance AI accelerators.
The 2.1D package substrates lack the silicon interposer that typically connects signals between the semiconductor chip and the substrate, allowing chips to be directly connected to one another. Through fine-circuit and high-density connection technologies, the substrates offer the high-speed, high-density chip connectivity that AI accelerators require.
Samsung Electro-Mechanics will also introduce its glass substrate technology at the exhibition. Made of glass, which is harder than conventional organic materials, the substrates reduce warping. They also secure signal characteristics and power efficiency while lowering the overall number of layers, drawing attention as a next-generation substrate solution.
The company plans to showcase technologies for creating fine connection channels in the glass material and filling them with metal, along with precision surface-processing techniques.
Samsung Electro-Mechanics' UTCSP substrates adopt a coreless structure that reduces substrate thickness along with fine bond finger technology. The product targets data centers and mobile devices that require high integration and slim form factors.
The company will also display automotive package substrates designed to withstand high-temperature, high-humidity environments and frequent temperature fluctuations, underscoring its competitiveness in substrates for autonomous vehicles.
"As the high-performance semiconductor market — including AI accelerators, servers and autonomous driving — grows, the role and technical difficulty of package substrates are rapidly increasing," said Ju Hyuk, vice president and head of the Package Solution Business at Samsung Electro-Mechanics. "Samsung Electro-Mechanics will advance its large-area, high-layer-count, ultra-fine circuit and next-generation packaging technologies to respond to the high-end semiconductor package substrate market."
joze@heraldcorp.com
