Zero-defect TGV drilling achieved at mass-production scale

Thicker glass substrates seen gaining traction as AI accelerators grow larger

Global customers complete technical validation; equipment orders in final stages

A rendering of Philoptics' exhibition booth at KPCA SHOW 2026. [Philoptics]
A rendering of Philoptics' exhibition booth at KPCA SHOW 2026. [Philoptics]

Philoptics will make the domestic debut of a 2.0mm-thick glass substrate for next-generation semiconductor packaging, positioning its defect-free through-glass via (TGV) drilling technology as a key differentiator in the global market as AI accelerators grow larger and demand thicker substrates.

The company said Monday it will showcase the 2.0mm TGV glass substrate at KPCA SHOW 2026, running Wednesday through Friday at Songdo Convensia in Incheon.

The core of the technology lies in drilling TGVs without defects even in thick glass. TGV is a process that creates electrical connection pathways by boring microscopic holes through a glass substrate; as the glass gets thicker, drilling becomes more difficult and defect rates tend to rise.

Philoptics said it applied its proprietary laser precision processing technology to achieve a TGV defective-hole rate of 0 parts per million (ppm) on a 510mm-by-515mm mass-production substrate — meaning not a single defective hole among 1 million drilled. The company said it also met all major quality benchmarks governing TGV performance, including penetration rate, taper angle, roundness, inner-wall roughness and hole-position accuracy.

The push toward thicker glass substrates is driven by the growing scale of AI semiconductors. Next-generation AI accelerators are incorporating more GPUs and HBM chips within a single package, expanding the substrate footprint. Larger substrates are more prone to warpage — bowing caused by chip heat — and increasing glass thickness raises the substrate's physical rigidity to counter the problem, the company said.

Thicker substrates also enable passive components such as multilayer ceramic capacitors (MLCCs) to be embedded inside. By using blind cavities — recesses machined to a set depth within the substrate — passive components can be placed closer to the chip, reducing signal loss, while the space they previously occupied on the surface can accommodate additional logic and memory chips.

Philoptics said it has completed technical validation of the TGV technology with multiple global customers. Equipment adoption by key overseas customers that lead the global semiconductor value chain is in effect confirmed, with administrative procedures for final orders now under way, the company said.

"We have stably achieved a TGV defective-hole rate of 0 ppm regardless of glass thickness, while also dramatically improving process speed," a Philoptics official said. "We will continue to introduce the highest-level laser precision processing equipment and set the global standard for next-generation glass substrate processing technology."

KPCA SHOW 2026, where Philoptics will present the new technology, is being held at its largest scale ever. Now in its 23rd year, the event will bring together 229 domestic and international companies — including LG Innotek, Samsung Electro-Mechanics, Simtech, Hana Micron and Stats ChipPAC Korea — across 895 booths. Exhibits will cover semiconductor substrates, advanced packaging, and related materials, components and equipment.


hajun825@heraldcorp.com