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New FC Bonder 3.5 targets AI system semiconductor market
Company broadens back-end equipment lineup beyond HBM TC bonders
US subsidiary to open by year-end to strengthen local customer support
Hanmi Semiconductor, the world's top maker of HBM bonding equipment, is moving into advanced packaging tools for AI system semiconductors. The company plans to extend its growth beyond HBM-focused TC bonders by targeting global foundries and outsourced semiconductor assembly and test, or OSAT, companies with 2.5D packaging equipment.
Hanmi Semiconductor announced Friday it has launched the FC Bonder 3.5, a new bonding tool for AI system semiconductors, and will supply it to global foundry and OSAT customers.
The equipment targets the 2.5D packaging process used in AI chip production — a technology that integrates multiple chips such as GPUs, CPUs and HBM into a single package. The process has emerged as a core step in AI semiconductor and high-performance computing production after being adopted by major technology companies including Nvidia, AMD, Broadcom, Marvell and Apple for their in-house AI chip manufacturing.
Having secured the top global position in the HBM TC bonder market, Hanmi Semiconductor now aims to expand its foothold in back-end equipment for system semiconductors. Following last year's launch of the FC Bonder 75, the new FC Bonder 3.5 broadens the company's product lineup to cover oversized die and multi-chip integration processes.
The FC Bonder 3.5 bonds 2.5D logic dies using a chip-to-wafer method and can handle large panels and substrates up to 340 millimeters. The company said the tool offers higher productivity and precision than competing products and meets the latest process standards required by global AI chipmakers.
AI semiconductor packaging is evolving toward panel-level packaging, with multi-die structures combining GPUs, CPUs and HBM replacing single-chip designs — making the ability to handle large substrates increasingly important. Hanmi Semiconductor said growing demand for 250-millimeter and 310-millimeter substrates in AI packaging processes positions the FC Bonder 3.5 to support next-generation AI chip production.
Beyond flip-chip bonding, the new tool also supports face-up bonding using die-attach film material, allowing it to accommodate both flip and non-flip bonding methods depending on each customer's process requirements.
Hanmi Semiconductor also plans to establish a US subsidiary, Hanmi USA, by the end of this year. The move is intended to strengthen sales and customer support for both HBM TC bonders and system semiconductor equipment in the US market, where major technology companies and chipmakers are concentrated.
"Building on the bonding technology proven through our HBM TC bonders, we will deliver results that contribute to sales in the new 2.5D packaging market," a company official said. "We will continue to introduce advanced packaging solutions suited to the AI semiconductor era."
The global advanced semiconductor packaging market is projected to grow at an average annual rate of 9.5 percent, from $46 billion in 2024 to $79.4 billion in 2030, according to market research firm Yole Intelligence.
hong@heraldcorp.com
