- Samsung Electronics, SK hynix and other industry, academic and research experts join forces to kick off K-Moonshot semiconductor mission

- Development to focus on HBM and ultra-fine semiconductors, with 'memory-centric computing' technology as a key target

KAIST researchers conduct AI semiconductor research. [Provided by KAIST]
KAIST researchers conduct AI semiconductor research. [Provided by KAIST]

The South Korean government is launching a full-scale effort to develop next-generation semiconductor technologies that overcome the chronic power consumption and performance limitations of AI chips. Samsung Electronics, SK hynix and other domestic chipmakers, universities and research institutions will join forces to secure next-generation semiconductor technologies, including HBM.

The Ministry of Science and ICT said Wednesday it will hold the inaugural meeting of the K-Moonshot Semiconductor Operating Committee and Technology Committee in Seoul to discuss a technology roadmap and implementation strategy for next-generation semiconductor development.

K-Moonshot is a government research and development program designed to tackle national challenges and accelerate technological innovation by combining AI with science and technology.

The semiconductor sector — one of 12 core missions under the program — aims to secure foundational technologies capable of overcoming the performance and power limitations of semiconductors across all everyday devices.

A central focus will be developing "memory-centric computing" technology that fundamentally rethinks the computational architecture of conventional chips. The key goals are reducing the data-movement bottlenecks that arise during AI processing and increasing the number of AI tokens a chip can handle per watt of power.

As semiconductor applications expand beyond generative AI into on-device AI and physical AI, power efficiency and computational performance have emerged as defining factors in national AI competitiveness.

Conventional semiconductors, however, are hitting the physical limits of miniaturization, while surging AI workloads are intensifying memory bottlenecks and power consumption.

In response, the government will pursue "full-stack" technology development that integrates semiconductor devices, processes, memory chips, packaging and systems into a single, cohesive framework.

Specifically, the effort will target ultra-fine semiconductors to push past the limits of miniaturization and next-generation stacked semiconductor technologies represented by HBM. Beyond improving individual component performance, the program will also pursue integrated validation — applying the technologies to real systems to verify performance and power efficiency.

The newly launched operating committee will be chaired by Kim Ji-young, the semiconductor program director, and will include experts from the Ministry of Science and ICT, the National Research Foundation of Korea, Samsung Electronics, SK hynix and Jusung Engineering.

The operating committee will be responsible for establishing and revising the basic plan for semiconductor R&D projects and deliberating on and coordinating major initiatives.

A separately constituted technology committee will support the development of core technology roadmaps, the planning of detailed research tasks, and the monitoring of research progress and goal management. It will also handle technical reviews to facilitate the application and dissemination of research outcomes in industry.

Through this structure, the government intends to organically link policy formulation, technology development and industrial application, and to reflect the rapidly shifting semiconductor landscape and industry demand in its R&D efforts.

Wednesday's meeting will focus on the prioritization of core technologies, phased development targets, ways to connect the initiative with existing semiconductor R&D programs, and an integrated validation strategy that incorporates industry needs.

"In the AI era, national semiconductor competitiveness will be determined not just by improving the performance of individual chips, but by the ability to organically connect devices, memory chips, and integration and packaging technologies to innovate the performance and power efficiency of entire systems," said Kim Seong-su, director general for R&D policy at the Ministry of Science and ICT.

"We will pool the capabilities of industry, academia and research institutions to proactively secure core foundational technologies for future semiconductors, and systematically advance the K-Moonshot semiconductor mission so that research outcomes translate into real industrial competitiveness," Kim added.


nbgkoo@heraldcorp.com