Debut at Asia's largest data center exhibition in Singapore

'Hydronic Modular' solution shown for first time

Pre-fabricated design cuts construction time and upfront investment

Oil-free inverter turbo chiller also on display

LG Electronics showcases AI data center cooling solutions, including 1 MW and 2.6 MW coolant distribution units with Nvidia approval, at Data Centre World Asia 2026, which opened Tuesday in Singapore. [LG Electronics]
LG Electronics showcases AI data center cooling solutions, including 1 MW and 2.6 MW coolant distribution units with Nvidia approval, at Data Centre World Asia 2026, which opened Tuesday in Singapore. [LG Electronics]

LG Electronics is expanding its business scope to become an "AI infrastructure partner" covering the full cycle of AI data center design, construction and operation — offering not only differentiated AI cooling solutions but also modular cooling infrastructure and operational solutions that reduce construction time and upfront investment costs.

The company participated in Data Centre World Asia 2026, Asia's largest data center exhibition, which opened Tuesday in Singapore, presenting a total solution spanning thermal management, power and operations for AI data centers.

At the exhibition, LG Electronics made the world debut of its Hydronic Modular solution, which integrates a large number of essential components — including pumps, valves and emergency buffer tanks — into a single unit.

The Hydronic Modular solution pre-fabricates pumps and piping as a finished assembly inside an ISO-standard container, allowing operators at an actual AI data center site to bring a cooling system online immediately by simply connecting the chiller unit to the container module, much like snapping blocks together. Previously, routing chilled water from a chiller to server rooms required extensive welding and on-site assembly of numerous pumps and pipes, consuming significant time and cost.

As AI usage surges, demand for rapidly building hyperscale AI data centers is also growing. LG Electronics' Hydronic Modular solution cuts both construction time and initial investment while enabling a swift response to future AI server scale-up needs. Standardized modules can be added as needed, allowing facility investment to proceed flexibly in line with a data center's expansion plans.

LG Electronics also unveiled an air-cooled, oil-free inverter turbo chiller optimized for AI data centers. The product uses a magnetic-bearing-based oil-free compressor to reduce friction losses and improve cooling efficiency. It also incorporates refrigerant pre-cooling technology, in which the compressor shuts down and refrigerant condensed by outside air circulates on its own to dissipate heat, helping cut energy consumption.

"We will leverage our total cooling solution optimized for hyperscale AI data centers to emerge as a key partner in the global AI infrastructure market," said Lee Jae-sung, president and head of LG Electronics' ES Business Division.


gil@heraldcorp.com