'DSX Ready CDU' certification secured

Targets high-density, high-heat AI data centers

Full CDU lineup completed after 600 kW and 1 MW approvals

'Chip to Chiller' total cooling solution business to expand

LG Electronics' liquid cooling solution CDU (Coolant Distribution Unit) lineup, from left: 600 kW, 1 MW and 2.5 MW models. [LG Electronics]
LG Electronics' liquid cooling solution CDU (Coolant Distribution Unit) lineup, from left: 600 kW, 1 MW and 2.5 MW models. [LG Electronics]

LG Electronics has secured Nvidia's certification for its 2.5 MW large-capacity coolant distribution unit (CDU), and plans to accelerate its push into the global AI data center market with a full suite of cooling solutions spanning chips to chillers.

LG Electronics said Tuesday its 2.5 MW CDU met additional requirements under Nvidia's AI factory certification process and was approved as a "DSX Ready CDU" product. Only three companies — LG Electronics, LiquidStack and Vertiv — appear on Nvidia's initial list of DSX Ready partners in the CDU category.

Nvidia operates the "Nvidia DSX AI Factory Platform," which integrates computing, networking, power, cooling, facilities and software. Products meeting the relevant requirements receive "DSX Ready" certification. For CDUs, the program targets large-capacity units of 2.3 MW or more used in AI factory construction.

LG Electronics' liquid cooling solution CDU. [LG Electronics]
LG Electronics' liquid cooling solution CDU. [LG Electronics]

LG Electronics received Nvidia certification for its 600 kW CDU in July and its 1 MW CDU in September, and has now added the 2.5 MW model to its DSX Ready lineup — demonstrating what the company calls top-tier technical capability in the liquid cooling market.

Meanwhile, LG Energy Solution's battery energy storage system (BESS) also received DSX Ready certification.

As the performance and power consumption of AI accelerators rise rapidly, expanding cooling capacity has become a key challenge for data centers. The latest AI server racks consume around 120 kW each, meaning a cooling group of 20 racks requires 2.4 to 2.5 MW of cooling capacity.

This is driving a shift away from the conventional "in-rack" approach — where a CDU is installed for each individual server rack — toward an "in-row" model, in which multiple racks are grouped together and cooled by a single large-capacity CDU.

LG Electronics' 2.5 MW CDU is designed for exactly these high-density, high-heat AI data center environments. It is engineered to supply coolant and manage heat for multiple high-heat server racks grouped together as a single unit.

The liquid cooling market itself is expected to grow rapidly. Market research firm TrendForce projects that the adoption rate of liquid cooling solutions in AI data centers will climb from 14 percent in 2024 to around 60 percent by 2027.

With this latest approval, LG Electronics said it has completed a full lineup of AI data center cooling solutions. The portfolio now includes chillers for producing chilled water, computer room air handlers (CRAHs), CDUs in 600 kW, 1 MW and 2.5 MW capacities, and cold plates that directly cool AI chips.

The company plans to expand its "Chip to Chiller" total cooling solution business — covering everything from directly removing heat generated by AI chips to dissipating heat from the entire data center to the outside.

"With this Nvidia DSX certification, we will begin supplying highly reliable and efficient cooling solutions to global big tech companies in earnest, and secure leadership in the next-generation liquid cooling market," said Lee Jae-sung, president of LG Electronics' ES Business Division.


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