A rendering of LG Chem's booth at Semicon Taiwan 2026. [LG Chem]
A rendering of LG Chem's booth at Semicon Taiwan 2026. [LG Chem]

LG Chem announced Wednesday that it will participate in Semicon Taiwan 2026, Asia's largest semiconductor exhibition.

The company will attend the event, running Sept. 2 through Sept. 4 at the Nangang Exhibition Center in Taipei, Taiwan, where it will present advanced packaging and power semiconductor material solutions for AI chips, including high-bandwidth memory (HBM) applications.

Semicon Taiwan is Asia's largest semiconductor exhibition, showcasing next-generation technology trends in advanced packaging and AI semiconductors. The event draws a broad range of industry participants, including chipmakers, outsourced semiconductor assembly and test companies, and substrate and packaging firms.

Through its Advanced Package Zone, LG Chem will introduce a range of materials used in advanced packaging processes for AI semiconductors — copper-clad laminates, glass core solutions, build-up film, dry film solder resist, photosensitive insulation dielectrics, die attach film, bonding and debonding solutions, and strippers for fine-process applications.

The Power Package Zone will feature materials designed to improve efficiency and thermal management in power semiconductors for AI data centers, including conductive sintering paste (silver and copper), thermal interface materials and a copper metal foam-based thermal management device solution.

"As the AI semiconductor and advanced packaging markets expand, customer demand for high-performance materials is growing," LG Chem President Kim Dong-chun said. "Based on our differentiated materials portfolio, we will deepen collaboration with semiconductor customers and actively pursue growth opportunities in the future semiconductor market."


klee@heraldcorp.com